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Qualcomm Snapdragon 820 specs and features

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The Snapdragon 820 will be manufactured on 14nm FinFET technology and includes:

  • X12 LTE modem
  • 64-bit capable custom Kryo CPU
  • Adreno 530 GPU
  • Hexagon 680 DSP with Hexagon Vector eXtensions and a sensor processing “low power island”
  • 14-bit Qualcomm Spectra ISP
  • Premiere features and capabilities leveraging the Qualcomm Zeroth platform, the company’s first neural processing platform
  • Qualcomm Snapdragon Smart Protect for real-time, on-device machine learning for detection of zero-day malware threats, designed to deliver improved personal privacy and device security.

Qualcomm Snapdragon 820 Specs
CPU – Up to 2.2 GHz quad-core (Quad-core custom 64-bit Qualcomm® Kryo™)
GPU – Qualcomm® Adreno™ 530 GPU Up to OpenGL ES 3.1+
DSP – Qualcomm® Hexagon™ 680 DSP
Camera – Up to 28 MP , Qualcomm® Spectra™ Image Sensor Processor (14-bit dual-ISP)
Video – Up to 4K Ultra HD capture and playback, H.264 (AVC), H.265 (HEVC)
Display - 4K Ultra HD on-device, 4K Ultra HD output, 1080p and 4K external display support
Charging – Qualcomm® Quick Charge™ 3.0

LTE Connectivity

  • Snapdragon X12 LTE with Global Mode
  • LTE Cat 12/13 (up to 600 Mbps DL 150 Mbps UL)
  • Up to 600 Mbps, 256-QAM DL
  • Up to 150 Mbps UL, 64-QAM UL
  • Carrier Aggregation
  • 3x20MHz DL, 2X20MHz UL

Global Mode

  • LTE FDD and TDD
  • EV-DO and CDMA 1x

Additional features include:

  • LTE/Wi-FI link aggregation
  • LTE-U
  • LTE Broadcast
  • LTE Dual SIM, Dual Active (DSDA)
  • HD Voice over 3G and VoLTE
  • Wi-Fi calling with LTE call continuity


  • Qualcomm® VIVE™ 802.11ac
  • 2×2 MU-MIMO
  • Tri-band Wi-Fi

RF – Qualcomm® RF360™ front end solution
Location – Qualcomm® IZat™ Gen8C
Qualcomm® Haven™ Security Suite:

  • Qualcomm® SecureMSM™ hardware and software
  • Snapdragon StudioAccess™ Content Protection
  • Qualcomm® SafeSwitch™ theft prevention solution
  • Qualcomm® Snapdragon Sense™ ID 3D fingerprint technology
  • Qualcomm® Snapdragon™ Smart Protect

Storage – UFS 2.0, eMMC 5.1, SD 3.0 (UHS-I)
Memory - LPDDR4 1866MHz dual-channel
Process Technology – 14 nm
USB – USB 3.0/2.0
Bluetooth – Bluetooth 4.1
NFC - Supported
Part Number – 8996

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